【YAMAHA】S10
Feature
Ultimate Flexibility to realize 3D MID* Placement
- Enhancement to 3D MID
- Large board handling capability
- Wide ranging component handling capability and high feeder capacity
- Ultimate flexibility and fast & easy setup
- *3D MID: Molded Interconnect Device
Specifications
S10 | |
---|---|
Board size(with buffer unused) | Min. L50 x W30mm to Max. L1,330 x W510mm (Standard L955) |
Board size(with input or output buffer used) | Min. L50 x W30mm to Max. L420 x W510mm |
Board size(with input and output buffers used) | Min. L50 x W30mm to Max. L330 x W510mm |
Board thickness | 0.4 – 4.8mm |
Board flow direction | Left to right (Std) |
Board transfer speed | Max 900mm/sec |
Placement speed (12 heads + 2 theta) Opt. Cond. | 0.08sec/CHIP (45,000CPH) |
Placement accuracy A (μ+3σ) | CHIP +/-0.040mm |
Placement accuracy B (μ+3σ) | IC +/-0.025mm |
Placement angle | +/-180 degrees |
Z axis control / Theta axis control | AC servo motor |
Component height | Max 30mm*1 (Pre-placed components: max 25mm) |
Applicable components | 0201 (mm) – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) |
Component package | 8 – 56mm tape (F1/F2 Feeders), 8 – 88mm tape (F3 Electric Feeders), stick, tray |
Drawback check | Vacuum check and vision check |
Screen language | English, Chinese, Korean, Japanese |
Board positioning | Board grip unit, front reference, auto conveyor width adjustment |
Component types | Max 90 types (8mm tape), 45 lanes x 2 |
Transfer height | 900 +/- 20mm |
Machine dimensions, weight | L1250xD1750xH1420mm, Approx. 1,200kg |
- *1Board thickness + Component height = Max 30mm
- Specifications and appearance are subject to change without prior notice.