【SHINKO SEIKI】 Vacuum soldering unit
This unit melts solder under vacuum to remove voids from the solder.
Since solder is pre-heated in a reduction atmosphere, flux-free soldering is enabled.
Mostly, this unit has been used to manufacture power devices and form bumps for flip chip bonding .
Vacuum soldering technology
Schematic view of N2 vacuum soldering unit for mass-production