【mek】D Series (Parallel inspection)

World’s first AOI for parallel inspection

Automatic optical inspection for top and bottom simultaneously.
Great effect for reducing inspection time for PCB with chip components and descrete components.

Equipped 2 camera units.
Inspection with 18 cameras in total consisted by main camera and 8 angular cameras for each camera unit.

Inspect both PCB face in parallel.
Parallel inspection is possible in one time with high performance 2 camera units mounted for both top and bottom inspection.
2 camera units are controlled accurately with newly developed technology, and each top and bottom is inspected independently. Inspection speed is same as one time inspection.

 

Equipped 2 monitors for simple operation

     
Left monitor displays PCB bottom face.   Right monitor displays PCB top face.

Effective for reducing inspection tact, reducing stress on PCB, space saving, and energy saving.
Manage the record of inspection result for both top and bottom in a set.

Possible to reduce the inspection tact by inspecting both top and bottom PCB faces in parallel, keeping same tact as one time inspection. Reduce the stress of PCB by avoiding flipping. Space-saving which needs a space for only one machine instead of two. This also leads to energy saving. All developments are considered for the merit of customer.
Labor cost for board flipping, and the cost for 1 top inspection machine is saved by installing D series machine.
CS-Repair, the data management software in Catch System, can manage the inspection data of both A face and B face in set for thorough traceability.
Possible to manage the inspection data of A face and B face by each PCB.
Note: Available with CS-Repair Ver2.0.0.0 or greater.

Specification

Model Name D22X-350L
External Dimension W878 x D916 x H1313 (mm)
Height will be 2000mm when warning tower light included.
Weight 270 kg
Power Supply AC 100 V  –  240 V
Power Consumption 700 W (Incl. PC)
Operating Environment 15 – 30 ℃ 15 – 80 %RH (No Condensation)
Motor Servo Motor × 6
Position Repeatability <± 0.05 mm
Max. Speed 720 mm/sec
Max. PCB size Min: 50×50 mm  Max: 350×250 mm
PCB Fixing Method PCB Top Clamping
PCB Thickness Min: 0.6 mm ~
PCB Weight 2 kg
Clearance Top Clearance 30 mm, Bottom Clearance 20 mm
Conveyer Speed 10 – 500 mm/sec
Camera for Top/Bottom 5 mega pixel main camera + 8 side cameras
Main Lens Telecentric Lens
Main Camera FoV 36 x 30 mm : 15 μ
Angle Camera FoV Approx. 6 x 6 mm : 12 μ
Lighting System White Light + Side Red Light + Diffuse-On Axis LED
or RGB Light + Diffuse-On Axis LED
(Option to select at point of purchase)
Inspection Algorithm Pattern Matching / Histogram
Inspection Stages Pre and post (re)flow
Inspection Targets SMT components, Through Hole mounted Devices
Component Inspection Presence, Shifting, Angle offset, Position detection, Polarity, Correctness, Bridges, Soldering, Solder ball, Alien substance, NG pattern matching, Sampling, Scratch, Smearing, Crack, Slit width
Z axis Stroke + 28 mm, – 2 mm
Inspection Speed Approx. 0.3sec/point (Depends on PCB type)

※Please note that above specification is subject to change without notice.
※Please be sure to confirm the updated specification at the time of purchase.