【TAMURA】TNV-MINI SERIES

REFLOW OVEN TNV-MINI SERIES

This Reflow soldering system is responsible for the soldering process (heating and cooling) of solder paste in SMT (surface mount technology).
It is a compact reflow device with a total length of 3m and 8 heating zones.
Although it is space-saving, the precise temperature settings of the 8 zones allow for a variety of Temperature profile conditions.

Product Features

  • COMPACT SIZE
  • include 8 heating zone in 3m length
  • 250mm width substrate compatible Space-saving machine
  • Temperature profiles that could not be obtained before can now be obtain as you wish
  • Compact and High performance
  • Can be select from “P Panel” and “X Panel”

Type”mini” machine line up

Type                           TVN25-308EM 対応可
Number of heating zone 8 6 10 12
Machine length(mm) 3,060 2,660 3,880 4,360

仕様

TNV25-308EM
Applicable boards MAX. W250 × L330 (mm)
M I N. W 50 × L 50 (mm)
Component height Upper 10, 15, 20, 25, 30mm
Lower 10, 15, 20, 25, 30mm
Boad placement allowance 4mm
N2 gas supply 99.99%以上 0.4～0.7Mpa
250NL/min以上
Conveyor height from floor (pass line) 900±20mm
Power source AC200V-50/60Hz-3φ 27kVA 78A
(In multi-grouping flip-frop specification)
Device dimensions W1,310×L3,060※1×H1,374※2(mm)
Weights apporox. 1,700kg
Conveyor speed 0.3～1.5 m/min

※仕様は予告なく変更する場合がございます。あらかじめご了承ください。

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