• 4,500 UPH (0.8 sec/unit)
    The top mounting capability in Flipchip bonders*
  • +/-10μm (3σ) Mounting accuracy (When using Yamaha’s standard components)
  • YWF Wafer Supply Unit ”6/8/12 inch”, “Expand Ring”, and “θ angle correction” applicable
  • 0.6×0.6mm to 18×18mm Components applicable
* December 2010, YAMAHA MOTOR investigation


Applicable PCB L50 x W30 to L250 x W200mm
**”Up to L340 x W340mm” is applicable. Please contact us separately.
Mounting accuracy When using Yamaha’s standard components [2F2F Heads & Multi-camera type] Repeatability (3) : +/- 0.010mm/unit +/- 0.05degree
[4M4M Heads & Multi-camera type] **under development Repeatability (3 ) : +/- 0.010mm/unit +/- 0.05degree
Mounting capability Optimum condition [2F2F Heads & Multi-camera type] 4,500UPH (0.8sec/unit) **excluding Dipping 3,600UPH (1.0sec/unit) **including Dipping
[4M4M Heads & Multi-camera type]**under development 5,500UPH (0.65sec/unit) **excluding Dipping 4,500UPH (0.8sec/unit) **including Dipping
Component supply configuration Wafer (6/8/12inch Flat ring), Waffle tray, Tape reel (8/12/16mm width)
Applicable components [Multi-camera] Flipchip : 0.6×0.6mm to 18x18mm Bump diameter 60μm or more Bump pitch 110μm or more Height 0.7mm or less
SMD Chip : 0402 (Metric base) to 20x20mm Height 6mm or less
Power supply 3-Phase AC 200/208/220/240/380/400/416V +/- 10% 50/60Hz
Air supply source 0.5MPa or more, in clean, dry state
External dimension
**excluding projections
L1,400 x W1,820 x H1,515mm (Main unit only)
L1,400 x W2,035 x H1,515mm (When YWF wafer supply unit is installed)
Weight Approx. 2,470kg (Main unit only)
Approx. 2,780kg (When YWF wafer supply unit is installed)

スワイプSpecifications and appearance are subject to change without prior notice.