【DEN-ON】UF-100 (Underfill Automatic Removal Machine)

Underfill Automatic Removal Machine

Features

• Patent-Acquired Device for Separating Underfill-Loaded Boards and Components
  A device that separates boards and components with underfill without causing damage.
• Automatic Removal of Underfill-Loaded BGA
  Automatically removes underfill-loaded BGA without scratching the components or boards.
• Safe Removal Without Contacting Surrounding Components
  Ensures safe removal without making contact with surrounding components.
• Easy Operation with Temperature Profile and Start Button
  Operates easily by calling up the temperature profile and pressing the start button.
• Space-Saving and Suitable for Desktop Use
  Compact design suitable for use on a desktop.