Patent-Acquired Device for Separating Underfill-Loaded Boards and Components A device that separates boards and components with underfill without causing damage.
Automatic Removal of Underfill-Loaded BGA Automatically removes underfill-loaded BGA without scratching the components or boards.
Safe Removal Without Contacting Surrounding Components Ensures safe removal without making contact with surrounding components.
Easy Operation with Temperature Profile and Start Button
Operates easily by calling up the temperature profile and pressing the start button.
Space-Saving and Suitable for Desktop Use
Compact design suitable for use on a desktop.