【DEN-ON】UF-100 (Underfill Automatic Removal Machine)

Underfill Automatic Removal Machine

Features

  • Patent-Acquired Device for Separating Underfill-Loaded Boards and Components
    A device that separates boards and components with underfill without causing damage.
  • Automatic Removal of Underfill-Loaded BGA
    Automatically removes underfill-loaded BGA without scratching the components or boards.
  • Safe Removal Without Contacting Surrounding Components
    Ensures safe removal without making contact with surrounding components.
  • Easy Operation with Temperature Profile and Start Button
    Operates easily by calling up the temperature profile and pressing the start button.
  • Space-Saving and Suitable for Desktop Use
    Compact design suitable for use on a desktop.